Invention Grant
- Patent Title: Surface-mounted magnetic-component module
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Application No.: US16924240Application Date: 2020-07-09
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Publication No.: US12165798B2Publication Date: 2024-12-10
- Inventor: Lee Francis , William Jarvis , Takayuki Tange
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/02 ; H01F27/24 ; H01F41/02 ; H01F41/04 ; H01F41/064 ; H01F41/12 ; H02P27/08

Abstract:
A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.
Public/Granted literature
- US20210012950A1 SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE Public/Granted day:2021-01-14
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