Invention Grant
- Patent Title: Gas cluster processing device and gas cluster processing method
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Application No.: US17585274Application Date: 2022-01-26
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Publication No.: US12172198B2Publication Date: 2024-12-24
- Inventor: Kazuya Dobashi , Takehiko Orii , Yukimasa Saito , Kunihiko Koike , Takehiko Senoo , Koichi Izumi , Yu Yoshino , Tadashi Shojo , Keita Kanehira
- Applicant: TOKYO ELECTRON LIMITED , IWATANI CORPORATION
- Applicant Address: JP Tokyo; JP Osaka
- Assignee: TOKYO ELECTRON LIMITED,IWATANI CORPORATION
- Current Assignee: TOKYO ELECTRON LIMITED,IWATANI CORPORATION
- Current Assignee Address: JP Tokyo; JP Osaka
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP2017-057086 20170323
- Main IPC: B08B5/02
- IPC: B08B5/02 ; B08B7/00 ; H01L21/67 ; H01L21/02

Abstract:
There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.
Public/Granted literature
- US20220143655A1 GAS CLUSTER PROCESSING DEVICE AND GAS CLUSTER PROCESSING METHOD Public/Granted day:2022-05-12
Information query
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