Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
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Application No.: US17482112Application Date: 2021-09-22
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Publication No.: US12174540B2Publication Date: 2024-12-24
- Inventor: An-Ren Zi , Ching-Yu Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: G03F7/09
- IPC: G03F7/09 ; G03F7/004 ; G03F7/105 ; G03F7/11 ; H01L21/027 ; H01L21/308

Abstract:
A method for manufacturing a semiconductor device includes forming a resist structure including forming a resist layer including a resist composition over a substrate. After forming the resist layer, the resist layer is treated with an additive. The additive is one or more selected from the group consisting of a radical inhibitor, a thermal radical initiator, and a photo radical initiator.
Public/Granted literature
- US20220291587A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2022-09-15
Information query
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