Invention Grant
- Patent Title: Substrate inspection method and device
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Application No.: US17668622Application Date: 2022-02-10
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Publication No.: US12175655B2Publication Date: 2024-12-24
- Inventor: Doyoung Yoon , Junghoon Kim , Ilsuk Park , Kwangil Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR10-2021-0100682 20210730
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06V10/14 ; G06V10/22

Abstract:
A substrate inspection method includes: (i) acquiring a plurality of defect of interest (DOI) images of a substrate having a DOI, under a corresponding plurality of different optical conditions, (ii) acquiring a plurality of DOI difference images from differences between the plurality of DOI images and a reference image, and (iii) acquiring a plurality of DOI difference-of-difference (DOD) images from differences between the plurality of DOI difference images. The method also includes setting two optical conditions corresponding to a DOI DOD image having the highest signal-to-noise ratio (SNR) among the plurality of DOI DOD images, as a first optical condition and a second optical condition, and acquiring a first image of the substrate under the first optical condition and a second image of the substrate under the second optical condition. A first difference image is also acquired, which is a difference between the first image and the reference image, and a second difference image is acquired, which is a difference between the second image and the reference image. A DOD image is acquired that is a difference between the first difference image and the second difference image. A low-SNR defect candidate region is then detected from the first difference image, the second difference image, and the DOD image.
Public/Granted literature
- US20230033089A1 SUBSTRATE INSPECTION METHOD AND DEVICE Public/Granted day:2023-02-02
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