Invention Grant
- Patent Title: Nonvolatile memory device
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Application No.: US17232500Application Date: 2021-04-16
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Publication No.: US12178043B2Publication Date: 2024-12-24
- Inventor: Geunwon Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR10-2020-0128953 20201006
- Main IPC: G11C8/14
- IPC: G11C8/14 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B43/10 ; H10B43/27 ; H10B43/35

Abstract:
A nonvolatile memory device may include a substrate; a first stacked structure on the substrate; a second stacked structure on the first stacked structure; a channel structure including a first portion passing through the first stacked structure and a second portion passing through the second stacked structure; and a filling structure including a first portion passing through the first stacked structure and extending in a first horizontal direction and a second portion passing through the second stacked structure and extending in the first horizontal direction. The upper end of the first portion of the filling structure may be at a same height as the upper end of the first portion of the channel structure.
Public/Granted literature
- US20220109004A1 NONVOLATILE MEMORY DEVICE Public/Granted day:2022-04-07
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