Invention Grant
- Patent Title: Connector and method for manufacturing the same
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Application No.: US17661282Application Date: 2022-04-28
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Publication No.: US12184005B2Publication Date: 2024-12-31
- Inventor: Ching-Ho Hsieh , Ming-Hsing Wu , Keui-Sheng Wu
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW111108433 20220308
- Main IPC: H01R13/17
- IPC: H01R13/17 ; H01R12/70

Abstract:
A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.
Public/Granted literature
- US20230291139A1 CONNECTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-09-14
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