Invention Grant
- Patent Title: Rigid flexible printed circuit board and electronic device comprising same
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Application No.: US17587580Application Date: 2022-01-28
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Publication No.: US12185464B2Publication Date: 2024-12-31
- Inventor: Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2019-0092500 20190730,KR10-2020-0094972 20200730
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01Q1/24 ; H05K1/11 ; H05K1/14 ; H05K1/18

Abstract:
An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
Public/Granted literature
- US20220151070A1 RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME Public/Granted day:2022-05-12
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