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公开(公告)号：US20220151070A1
公开(公告)日：2022-05-12
申请号：US17587580
申请日：2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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Patent Agency Ranking
公开(公告)号：US11510312B2
公开(公告)日：2022-11-22
申请号：US17265888
申请日：2019-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
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公开(公告)号：US12185464B2
公开(公告)日：2024-12-31
申请号：US17587580
申请日：2022-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon , Donggon Jang , Kisoo Jung , Seounghyun Hong , Hyunsung Hwang
Abstract: An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.
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公开(公告)号：US11617257B2
公开(公告)日：2023-03-28
申请号：US17298810
申请日：2021-05-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.
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公开(公告)号：US12144115B2
公开(公告)日：2024-11-12
申请号：US18084994
申请日：2022-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Dohyeon Kim , Byeongkeol Kim , Jinsu Kim , Seokjoon Park , Jungje Bang , Hoyeon Seo , Jongbum Lee , Jongmin Jeon
Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.
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公开(公告)号：US11564311B2
公开(公告)日：2023-01-24
申请号：US17171461
申请日：2021-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Byeongkeol Kim , Yeongjin Lee , Jongmin Jeon , Jaeyoub Jung , Eunseok Hong
Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.
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