Invention Grant
- Patent Title: 3D printable resin compositions
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Application No.: US17802669Application Date: 2021-02-26
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Publication No.: US12195618B2Publication Date: 2025-01-14
- Inventor: FuKe Wang , Yi Ting Chong
- Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
- Applicant Address: SG Singapore
- Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
- Current Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
- Current Assignee Address: SG Singapore
- Agency: MARSHALL, GERSTEIN & BORUN LLP
- Priority: SG10202001784W 20200227
- International Application: PCT/SG2021/050097 WO 20210226
- International Announcement: WO2021/173084 WO 20210902
- Main IPC: B33Y70/00
- IPC: B33Y70/00 ; C08L33/10 ; B29C64/124 ; B29K33/00 ; B29K105/00 ; B33Y10/00
Abstract:
This invention relates to a resin composition comprising at least one of a first monomeric or oligomeric component (A), at least one of a second monomeric or oligomeric component (B) and a photoinitiator. This invention also relates to a method of preparing a polymer from the resin composition, a polymer prepared from the resin composition, a method of forming a 3-dimensional printed article, and a kit comprising at least one of a first monomeric or oligomeric component (A), at least one of a second monomeric or oligomeric component (B) and a photoinitiator.
Public/Granted literature
- US20230122021A1 3D Printable Resin Compositions Public/Granted day:2023-04-20
Information query
