Invention Grant
- Patent Title: Semiconductor devices and method of manufacturing the same
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Application No.: US18130010Application Date: 2023-04-03
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Publication No.: US12199099B2Publication Date: 2025-01-14
- Inventor: Jung-Gil Yang , Geum-Jong Bae , Dong-Il Bae , Seung-Min Song , Woo-Seok Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR10-2016-0172883 20161216
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8234 ; H01L21/8238 ; H01L27/088 ; H01L29/06 ; H01L29/41 ; H01L29/66 ; H01L29/775 ; H01L29/786 ; H01L29/165 ; H01L29/20 ; H01L29/423 ; H01L29/78

Abstract:
A semiconductor device includes a first transistor in a first region of a substrate and a second transistor in a second region of the substrate. The first transistor includes multiple first semiconductor patterns; a first gate electrode; a first gate dielectric layer; a first source/drain region; and an inner-insulating spacer. The second transistor includes multiple second semiconductor patterns; a second gate electrode; a second gate dielectric layer; and a second source/drain region. The second gate dielectric layer extends between the second gate electrode and the second source/drain region and is in contact with the second source/drain region. The first source/drain region is not in contact with the first gate dielectric layer.
Public/Granted literature
- US20230238383A1 SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-07-27
Information query
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