Invention Grant
- Patent Title: Process to improve coverage and electrical performance of solid electrolytic capacitors
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Application No.: US17708196Application Date: 2022-03-30
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Publication No.: US12205775B2Publication Date: 2025-01-21
- Inventor: Yaru Shi , Antony P. Chacko , Ajaykumar Bunha
- Applicant: KEMET Electronics Corporation
- Applicant Address: US FL Fort Lauderdale
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US FL Fort Lauderdale
- Agency: Patent Filing Specialist Inc.
- Agent Joseph T. Guy
- Main IPC: H01G9/15
- IPC: H01G9/15 ; H01G9/00 ; H01G9/028 ; H01G9/048 ; H01G9/04

Abstract:
Provided herein is a method for forming a capacitor and an improved capacitor formed by the method. The method comprises providing an anode with an anode lead extending therefrom. A dielectric is formed on the anode thereby forming an anodized anode. A cathode layer is formed over the dielectric wherein the cathode layer is formed by applying a conductive polymer solution or dispersion and applying a primer solution or dispersion comprising a monophosphonium or monosulfonium cation.
Public/Granted literature
- US20220223351A1 Process to Improve Coverage and Electrical Performance of Solid Electrolytic Capacitors Public/Granted day:2022-07-14
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