Invention Grant
- Patent Title: Compact high-directivity directional coupler structure using interdigitated coupled lines
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Application No.: US18115327Application Date: 2023-02-28
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Publication No.: US12206154B2Publication Date: 2025-01-21
- Inventor: Anirban Sarkar , Tienyu Chang , Siuchuang Ivan Lu , Sang Won Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Main IPC: H01P5/18
- IPC: H01P5/18 ; H01P1/18 ; H01Q23/00

Abstract:
Disclosed is a device including a first line, a second line including a first section disposed on a first side of the first line and a second section disposed on a second side of the first line, the second side being opposite to the first side and the second section being separate from the first section by a distance, and at least one bridge electrically connecting an end of the first section with an end of the second section and extending across the first line. The device may be a directional coupler that achieves significantly higher directivity than conventional directional coupler structures, and hence, improves power detection accuracy.
Public/Granted literature
- US20230208005A1 COMPACT HIGH-DIRECTIVITY DIRECTIONAL COUPLER STRUCTURE USING INTERDIGITATED COUPLED LINES Public/Granted day:2023-06-29
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