Invention Grant
- Patent Title: Cutting apparatus
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Application No.: US17653375Application Date: 2022-03-03
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Publication No.: US12208482B2Publication Date: 2025-01-28
- Inventor: Hiroki Aikawa
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2021-048443 20210323
- Main IPC: B24B27/06
- IPC: B24B27/06 ; B24B41/06

Abstract:
A cutting apparatus includes a chuck table configured to hold the workpiece, and a cutting unit fitted with a cutting blade including an annular base and a cutting edge that includes abrasive grains and a binder configured to fix the abrasive grains, and is formed along an outer circumferential edge of the base. The cutting unit includes a spindle, a blade mount fitted to a distal end portion of the spindle, and a fixing nut configured to fix the cutting blade to the blade mount, and the blade mount or the fixing nut is provided with a corrosion layer formed of a material having a higher ionization tendency than a material constituting the binder.
Public/Granted literature
- US20220305608A1 CUTTING APPARATUS Public/Granted day:2022-09-29
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