Method for slicing ingot and wire saw

    公开(公告)号:US12186939B2

    公开(公告)日:2025-01-07

    申请号:US17042236

    申请日:2019-04-10

    Abstract: A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact portion between the ingot and the wire with a slurry from a nozzle, thereby slicing the ingot into wafers. The slurry is supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more sections of the nozzle which are orthogonal to a travelling direction of the wire row. Consequently, a wire saw and a method for slicing an ingot are provided which enable separate control of wafer shapes depending on ingot-slicing positions.

    Automatic Chuck Apparatus, Grinding Wheel Cutting Apparatus and Cutting Method

    公开(公告)号:US20220152773A1

    公开(公告)日:2022-05-19

    申请号:US17599542

    申请日:2020-03-30

    Abstract: The present disclosure provides an automatic chuck apparatus comprising a mechanical chuck, a mechanical chuck mounting bracket, a hydraulic motor, a lifting mechanism, a chuck key and a lifting cylinder. The mechanical chuck is mounted above the mechanical chuck mounting bracket. The hydraulic motor, the lifting mechanism and the lifting cylinder are mounted below the mechanical chuck mounting bracket. The hydraulic motor is configured to control the rotation of the chuck key, the lifting cylinder is configured to drive the chuck key to ascend or descend through the lifting mechanism, thereby the mechanical chuck is locked or loosened by the chuck key. The present disclosure further provides a grinding wheel cutting apparatus and a cutting method. In the present disclosure, the locking of the chuck is automatically controlled, thereby improving the working efficiency and ensuring sufficient locking force of the chuck.

    Grinding Wheel Apparatus, Grinding Wheel Cutting Apparatus and Cutting Method

    公开(公告)号:US20220143782A1

    公开(公告)日:2022-05-12

    申请号:US17599543

    申请日:2020-03-30

    Abstract: The present disclosure provides a grinding wheel apparatus comprising a grinding wheel, a flange, a pull rod and a spindle. The grinding wheel is mounted on one side of the flange, and the other side of the flange is a tapered bucket, the tapered bucket has a buckle slot. The pull rod passes through the spindle, and a pull rod head of the pull rod is fixed to one end of the spindle, the tapered bucket is inserted into the spindle from the other end of the spindle, and the buckle slot is engaged with the T-shaped buckle of the pull rod in the spindle to fix the flange on which the grinding wheel is mounted to the other end of the spindle. The present disclosure further provides a grinding wheel cutting apparatus comprising the grinding wheel apparatus, and a cutting method using the grinding wheel cutting apparatus.

    METHOD FOR SLICING INGOT AND WIRE SAW

    公开(公告)号:US20210114257A1

    公开(公告)日:2021-04-22

    申请号:US17042236

    申请日:2019-04-10

    Abstract: A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact portion between the ingot and the wire with a slurry from a nozzle, thereby slicing the ingot into wafers. The slurry is supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more sections of the nozzle which are orthogonal to a travelling direction of the wire row. Consequently, a wire saw and a method for slicing an ingot are provided which enable separate control of wafer shapes depending on ingot-slicing positions.

Patent Agency Ranking