Invention Grant
- Patent Title: Impedance measurement jig and method of controlling a substrate-processing apparatus using the jig
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Application No.: US17591751Application Date: 2022-02-03
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Publication No.: US12210045B2Publication Date: 2025-01-28
- Inventor: Byeongsang Kim , Dougyong Sung , Sungjin Kim , Yunhwan Kim , Inseok Seo , Seungbo Shim , Naohiko Okunishi , Minyoung Hur
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2021-0088908 20210707
- Main IPC: G01R27/16
- IPC: G01R27/16 ; C23C16/455 ; C23C16/52 ; H01L21/66 ; H01L21/67 ; H01L21/683

Abstract:
An impedance measurement jig may include a first contact plate, a second contact plate, a cover plate, a plug, and an analyzer. The first contact plate may make electrical contact with an ESC in a substrate-processing apparatus. The second contact plate may make electrical contact with a focus ring configured to surround the ESC. The cover plate may be configured to cover an upper surface of the substrate-processing apparatus. The plug may be installed at the cover plate to selectively make contact with the first contact plate or the second contact plate. The analyzer may individually apply a power to the first contact plate and the second contact plate through the plug to measure an impedance of the ESC and an impedance of the focus ring. Thus, the impedances of the ESC and the focus ring may be individually measured to inspect the ESC and/or the focus ring.
Public/Granted literature
- US20230010881A1 IMPEDANCE MEASUREMENT JIG AND METHOD OF CONTROLLING A SUBSTRATE-PROCESSING APPARATUS USING THE JIG Public/Granted day:2023-01-12
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