Invention Grant
- Patent Title: Method for forming FinFET devices with a fin top hardmask
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Application No.: US17576854Application Date: 2022-01-14
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Publication No.: US12211921B2Publication Date: 2025-01-28
- Inventor: Kuo-Cheng Ching , Kai-Chieh Yang , Ching-Wei Tsai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
Aspects of the disclosure provide a method for forming a fin field effect transistor (FinFET) incorporating a fin top hardmask on top of a channel region of a fin. Because of the presence of the fin top hardmask, a gate height of the FinFET can be reduced without affecting proper operations of vertical gate channels on sidewalls of the fin. Consequently, parasitic capacitance between a gate stack and source/drain contacts of the FinFET can be reduced by lowering the gate height of the FinFET.
Public/Granted literature
- US20220140103A1 METHOD FOR FORMING FINFET DEVICES WITH A FIN TOP HARDMASK Public/Granted day:2022-05-05
Information query
IPC分类: