Invention Grant
- Patent Title: Wireless headset
-
Application No.: US17638361Application Date: 2020-07-16
-
Publication No.: US12212943B2Publication Date: 2025-01-28
- Inventor: Fang-Ching Lee , Shijia Pi , Lin Lu , Guofei Diao , Zhonghua Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Guangdong
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Priority: CN201910790820.8 20190826
- International Application: PCT/CN2020/102242 WO 20200716
- International Announcement: WO2021/036560 WO 20210304
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.
Public/Granted literature
- US20220295187A1 WIRELESS HEADSET Public/Granted day:2022-09-15
Information query