公开(公告)号：US20210092221A1

公开(公告)日：2021-03-25

申请号：US16961462

申请日：2018-01-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiao Yang ,  Fang-Ching Lee

IPC: H04M3/02 ,  G06F3/16 ,  H04R3/00

Abstract: A terminal device includes a processor, a direct stream digital (DSD) audio playback circuit, and a headset jack. The processor is connected to the DSD audio playback circuit, and the DSD audio playback circuit is connected to the headset jack. The processor outputs a DSD audio signal to the DSD audio playback circuit in response to triggering performed by a user. The DSD audio playback circuit is configured to process the DSD audio signal, generate an alert tone based on a current scenario, and superpose the processed DSD audio signal and the alert tone. The headset jack is configured to connect to a headset and play the superposed audio signal and alert tone using the headset.

公开(公告)号：US12212943B2

公开(公告)日：2025-01-28

申请号：US17638361

申请日：2020-07-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Fang-Ching Lee ,  Shijia Pi ,  Lin Lu ,  Guofei Diao ,  Zhonghua Wang

IPC: H04R1/10 ,  H04R5/033

Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.

公开(公告)号：US10063198B2

公开(公告)日：2018-08-28

申请号：US15555349

申请日：2015-03-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Fang-Ching Lee ,  Yanhui Ren ,  Fushun Chen

IPC: H03F3/217 ,  H04R29/00 ,  H03F3/68

CPC classification number: H03F3/2175 ,  H03F3/185 ,  H03F3/68 ,  H03F2200/03 ,  H04Q3/00 ,  H04R3/12 ,  H04R5/04 ,  H04R29/00 ,  H04R2420/03 ,  H04R2420/05 ,  H04R2420/09

Abstract: A terminal device includes: an access unit, connected between a headset or an audio speaker and a digital-to-analog converter, and configured for insertion of a detachable second power amplifier; a processor, configured to: detect whether the second power amplifier is inserted into the access unit, output a first digital signal when detecting that the second power amplifier is inserted, and output a second digital signal when detecting that the second power amplifier is not inserted; the digital-to-analog converter, connected to the processor, and configured to: when receiving the first digital signal, convert the first digital signal to a first analog signal, and send the first analog signal to the second power amplifier; and when receiving the second digital signal, convert the second digital signal to a second analog signal, and send the second analog signal to a first power amplifier.

公开(公告)号：US20210021934A1

公开(公告)日：2021-01-21

申请号：US17040324

申请日：2018-04-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiao Yang ,  Ligang Yu ,  Fang-Ching Lee

IPC: H04R9/02 ,  H04R9/06

Abstract: A speaker includes a front cover, a coil, a frame, a magnet, a magnetic diaphragm, and a voice coil. The coil is located on an inner side of the front cover, the magnetic diaphragm is located between the coil and the voice coil, a periphery of the magnetic diaphragm is adhered to one side of the frame, the magnet is located on the other side of the frame, and the one side and the other side of the frame are two opposite sides of the frame. The voice coil is configured to drive the magnetic diaphragm to vibrate.

公开(公告)号：US20170353803A1

公开(公告)日：2017-12-07

申请号：US15539625

申请日：2014-12-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Ding ,  Fang-Ching Lee

IPC: H04R19/04 ,  H04R1/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R1/083 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: Embodiments of the present invention provide a microphone, including: a metal cover and a printed circuit board PCB that is connected to the metal cover and that is provided with a sound pickup hole, and further including a boss that is provided with a through hole, where the boss is disposed on a side, away from the metal cover, of the PCB, and the boss is located on a soldering pad surrounding the sound pickup hole, so as to prevent soldering tin and a solder flux from entering the sound pickup hole, and the through hole is in communication with the sound pickup hole, so that an audio signal enters the sound pickup hole through the through hole.