Invention Grant
- Patent Title: Integrating control circuits with light emissive circuits with dissimilar wafer sizes
-
Application No.: US17193871Application Date: 2021-03-05
-
Publication No.: US12224271B2Publication Date: 2025-02-11
- Inventor: Rajendra D. Pendse
- Applicant: Meta Platforms Technologies, LLC
- Applicant Address: US CA Menlo Park
- Assignee: Meta Platforms Technologies, LLC
- Current Assignee: Meta Platforms Technologies, LLC
- Current Assignee Address: US CA Menlo Park
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; G06F1/16 ; H01L21/683 ; H01L25/075 ; H01L25/16 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L33/52 ; H01L33/62 ; G02B27/01
Abstract:
In some examples, an article comprises a semiconductor including at least one integrated circuit, a μLED array on a first surface of the semiconductor, and a fill material disposed on a first edge of the semiconductor. The first edge of the μLED array or the semiconductor is oriented substantially perpendicular to the first surface of the semiconductor.
Public/Granted literature
- US20210288036A1 INTEGRATING CONTROL CIRCUITS WITH LIGHT EMISSIVE CIRCUITS WITH DISSIMILAR WAFER SIZES Public/Granted day:2021-09-16
Information query
IPC分类:
