Invention Grant
- Patent Title: Integrated circuit with configurable on-die termination
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Application No.: US18504032Application Date: 2023-11-07
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Publication No.: US12224748B2Publication Date: 2025-02-11
- Inventor: Huy Nguyen
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Agency: Silicon Edge Law Group LLP
- Agent Arthur J. Behiel
- Main IPC: H03K19/00
- IPC: H03K19/00 ; H04B1/04 ; H04L25/02

Abstract:
Described are integrated-circuit die with differential receivers, the inputs of which are coupled to external signal pads. Termination legs coupled to the signal pads support multiple termination topologies. These termination legs can support adjustable impedances, capacitances, or both, which may be controlled using an integrated memory.
Public/Granted literature
- US20240146304A1 INTEGRATED CIRCUIT WITH CONFIGURABLE ON-DIE TERMINATION Public/Granted day:2024-05-02
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