Invention Grant
- Patent Title: Fluidic die having trickle-warming and pulse-warming circuits
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Application No.: US18018253Application Date: 2020-07-31
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Publication No.: US12233645B2Publication Date: 2025-02-25
- Inventor: Eric Thomas Martin , Garrett E. Clark , Jeremy Spencer , Vincent C. Korthuis , Rogelio Cicili
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2020/044429 WO 20200731
- International Announcement: WO2022/025915 WO 20220203
- Main IPC: B41J2/045
- IPC: B41J2/045
Abstract:
A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.
Public/Granted literature
- US20230286262A1 FLUIDIC DIE HAVING TRICKLE-WARMING AND PULSE-WARMING CIRCUITS Public/Granted day:2023-09-14
Information query
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