Invention Grant
- Patent Title: Substrates with solder barriers on leads
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Application No.: US16175279Application Date: 2018-10-30
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Publication No.: US12237249B2Publication Date: 2025-02-25
- Inventor: Bernardo Gallegos , Madison Koziol
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/00
Abstract:
A system comprises a substrate. The substrate comprises a lead. The system also comprises a solder barrier formed on the lead. The solder barrier is to contain a solder bump within a solder area on the lead. The system further includes a solder bump in the solder area and a die having an active surface coupled to the solder bump.
Information query
IPC分类:
