Invention Grant
- Patent Title: Active protection circuits for semiconductor devices
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Application No.: US18142992Application Date: 2023-05-03
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Publication No.: US12237278B2Publication Date: 2025-02-25
- Inventor: Michael A. Smith , Kenneth W. Marr
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H10B41/27 ; H10B41/41 ; H10B43/27 ; H10B43/40

Abstract:
Active protection circuits for semiconductor devices, and associated systems and methods, are disclosed herein. The active protection circuits may protect various components of the semiconductor devices from process induced damage—e.g., stemming from process charging effects. In some embodiments, the active protection circuit includes an FET and a resistor coupled to certain nodes (e.g., source plates for 3D NAND memory arrays) of the semiconductor devices, which may be prone to accumulate the process charging effects. The active protection circuits prevent the nodes from reaching a predetermined voltage during process steps utilizing charged particles. Subsequently, metal jumpers may be added to the active protection circuits to deactivate the FETs for normal operations of the semiconductor devices. Further, the FET and the resistor of the active protection circuit may be integrated with an existing component of the semiconductor device.
Public/Granted literature
- US20230275042A1 ACTIVE PROTECTION CIRCUITS FOR SEMICONDUCTOR DEVICES Public/Granted day:2023-08-31
Information query
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