Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US18619261Application Date: 2024-03-28
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Publication No.: US12243945B2Publication Date: 2025-03-04
- Inventor: Shunpei Yamazaki , Haruyuki Baba , Naoki Okuno , Yoshihiro Komatsu , Toshikazu Ohno
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2018-129050 20180706,JP2018-132300 20180712,JP2018-156319 20180823,JP2018-168236 20180907,JP2018-224773 20181130,JP2019-030032 20190222,JP2019-042602 20190308
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/51 ; H01L29/786

Abstract:
A semiconductor device having a large on-state current and high reliability is provided. The semiconductor device includes a first insulator, a first oxide over the first insulator, a second oxide over the first oxide, a third oxide and a fourth oxide over the second oxide, a first conductor over the third oxide, a second conductor over the fourth oxide, a fifth oxide over the second oxide, a second insulator over the fifth oxide, and a third conductor over the second insulator. The fifth oxide is in contact with a top surface of the second oxide, a side surface of the first conductor, a side surface of the second conductor, a side surface of the third oxide, and a side surface of the fourth oxide. The second oxide contains In, an element M, and Zn. The first oxide and the fifth oxide each contain at least one of constituent elements included in the second oxide. The third oxide and the fourth oxide each contain the element M. The third oxide and the fourth oxide include a region where the concentration of the element M is higher than that in the second oxide.
Public/Granted literature
- US20240387741A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2024-11-21
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