Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US18632624Application Date: 2024-04-11
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Publication No.: US12255019B2Publication Date: 2025-03-18
- Inventor: Jin Bok Shin , Yu Ra Shin , Seung Yong Lee , Jung Hyun An , Yong Hwa Lee , Da Hyeon Go , Choong Seop Jeon , Min Soo Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR10-2020-0189099 20201231
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/232

Abstract:
A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
Public/Granted literature
- US20240258031A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2024-08-01
Information query