公开(公告)号：US10699850B2

公开(公告)日：2020-06-30

申请号：US16177093

申请日：2018-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong Lee ,  Yu Ra Shin ,  Hak Kwan Kim ,  Jin Bok Shin ,  Myung Joo Lee

IPC: H01G4/12 ,  C04B35/468 ,  H01G4/30 ,  C01B32/182 ,  H01G4/008

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.

公开(公告)号：US20240170213A1

公开(公告)日：2024-05-23

申请号：US18134752

申请日：2023-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong Lee ,  Dong Chan Seo ,  Yong Hwa Lee ,  Sang Jin Park ,  Jin Bok Shin

IPC: H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/2325 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed outside the body and connected to the internal electrode, in which the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains includes a core-shell structure including an inner core area and a shell area covering at least a portion of the core area, and 90% or more of the plurality of dielectric crystal grains satisfy an average size of 170.0 nm to 190.0 nm, and a maximum deviation of sizes of the dielectric crystal grains satisfies ±60.0 nm compared to an average size of the dielectric crystal grains.

公开(公告)号：US12255019B2

公开(公告)日：2025-03-18

申请号：US18632624

申请日：2024-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok Shin ,  Yu Ra Shin ,  Seung Yong Lee ,  Jung Hyun An ,  Yong Hwa Lee ,  Da Hyeon Go ,  Choong Seop Jeon ,  Min Soo Kim

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

公开(公告)号：US12009151B2

公开(公告)日：2024-06-11

申请号：US17686951

申请日：2022-03-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Soo Kim ,  Jung Hyun An ,  Yun Kim ,  Seung Yong Lee ,  Dong Chan Seo ,  Yu Ra Shin ,  Jin Bok Shin ,  Choong Seop Jeon ,  Yun Jeong Cha

IPC: H01G4/12 ,  C04B35/468 ,  C04B35/628 ,  C04B35/64 ,  C04B37/00 ,  H01G4/232

CPC classification number: H01G4/1227 ,  C04B35/4682 ,  C04B35/62815 ,  C04B35/64 ,  C04B37/003 ,  H01G4/2325 ,  C04B2235/3224 ,  C04B2235/3236 ,  C04B2237/346

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The dielectric layer includes dielectric grains, at least a portion of the dielectric grains has a core-shell structure, and a shell of the core-shell structure contains a rare earth element having an average concentration of more than 0.5 at %.

公开(公告)号：US11984264B2

公开(公告)日：2024-05-14

申请号：US17512063

申请日：2021-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok Shin ,  Yu Ra Shin ,  Seung Yong Lee ,  Jung Hyun An ,  Yong Hwa Lee ,  Da Hyeon Go ,  Choong Seop Jeon ,  Min Soo Kim

IPC: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.