Invention Grant
- Patent Title: Method for manufacturing leadless semiconductor package with wettable flanks
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Application No.: US18435915Application Date: 2024-02-07
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Publication No.: US12255076B2Publication Date: 2025-03-18
- Inventor: Ian Harvey Arellano , Aaron Cadag , Ela Mia Cadag
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: PH Calamba
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: PH Calamba
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L23/495 ; H01L21/56
Abstract:
The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
Public/Granted literature
- US20240178006A1 LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2024-05-30
Information query
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