Invention Grant
- Patent Title: Semiconductor device and layout method of the same
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Application No.: US17867195Application Date: 2022-07-18
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Publication No.: US12255140B2Publication Date: 2025-03-18
- Inventor: Seungil Chai , Kyunghee Shin , Daehee Lee , Moonhui Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2021-0141121 20211021
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H10B41/35

Abstract:
A semiconductor device, includes a plurality of semiconductor elements, each of the plurality of semiconductor elements including a gate structure extending in a first direction and an active region provided on both sides of the gate structure in a second direction intersecting the first direction; and a plurality of interconnection patterns connected to the plurality of semiconductor elements, wherein the plurality of interconnection patterns include a plurality of upper interconnections provided above the plurality of semiconductor elements in a third direction, a plurality of intermediate interconnections provided between the plurality of semiconductor elements and the plurality of upper interconnections in the third direction, and a routing interconnection adjacent to at least one of the plurality of semiconductor elements in the second direction, wherein the routing interconnection is connected to at least one of the plurality of intermediate interconnections in the first direction or the second direction.
Public/Granted literature
- US20230132080A1 SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME Public/Granted day:2023-04-27
Information query
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