Invention Grant
- Patent Title: Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein
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Application No.: US17243784Application Date: 2021-04-29
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Publication No.: US12255147B2Publication Date: 2025-03-18
- Inventor: Jeremy Ecton , Brandon Marin , Srinivas Pietambaram , Suddhasattwa Nad
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/498 ; H01L25/065

Abstract:
An electronic substrate may be fabricated having at least two glass layers separated by an etch stop layer, wherein a bridge is embedded within one of the glass layers. The depth of a cavity formed for embedding the bridge is control by the thickness of the glass layer rather than by controlling the etching process used to form the cavity, which allows for greater precision in the fabrication of the electronic substrate. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate, such that the bridge provides device-to-device interconnection between the at least two integrated circuit devices. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board.
Public/Granted literature
- US20220352076A1 ELECTRONIC SUBSTRATE HAVING AN EMBEDDED ETCH STOP TO CONTROL CAVITY DEPTH IN GLASS LAYERS THEREIN Public/Granted day:2022-11-03
Information query
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