Invention Grant
- Patent Title: Support server high availability with network link bonding for cloud overlay networks
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Application No.: US17219470Application Date: 2021-03-31
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Publication No.: US12261775B2Publication Date: 2025-03-25
- Inventor: Santosh Narayan Shilimkar , Bryce Eugene Bockman , Steven Chervets , Jagwinder Singh Brar , Raman Kumar Sonkhla
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04L45/586
- IPC: H04L45/586 ; G06F9/455 ; H04L41/12 ; H04L41/16 ; H04L43/0805 ; H04L43/0817 ; H04L43/10 ; H04L45/02 ; H04L45/28 ; H04L61/5007 ; H04L67/10 ; H04L101/622

Abstract:
Systems and methods for support server high availability with network link bonding for cloud overlay networks are disclosed herein. The method can include selecting a compute instance, identifying a plurality of Network Virtualization Devices (“NVD”) for association with the compute instance, and creating a number of Virtualized Network Interface Cards (“VNIC”), each of which VNICs can reside in one of the plurality of NVDs. The method can include overlaying an IP address of the compute instance to each of the VNICs, such that each of the VNICs share a common IP address, designating a network path formed by one of the VNICs in one of the NVDs as an active network path and another of the network paths as an inactive network path, and activating the inactive network path when the active network path fails.
Public/Granted literature
- US20220182318A1 SUPPORT SERVER HIGH AVAILABILITY WITH NETWORK LINK BONDING FOR CLOUD OVERLAY NETWORKS Public/Granted day:2022-06-09
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