Invention Grant
- Patent Title: Nonvolatile memory device
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Application No.: US17736384Application Date: 2022-05-04
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Publication No.: US12268001B2Publication Date: 2025-04-01
- Inventor: Jung-Hwan Lee , Hyun Min Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2021-0087878 20210705
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B43/10 ; H10B43/30

Abstract:
A nonvolatile memory device with improved reliability is provided. The nonvolatile memory device comprises a substrate, a mold structure including a plurality of word lines stacked on the substrate, a first word line cut region configured to cut the mold structure, a first channel structure spaced apart from the first word line cut region by a first distance, and disposed in the mold structure and the substrate, and a second channel structure spaced apart from the first word line cut region by a second distance, and disposed in the mold structure and the substrate, wherein the second distance is greater than the first distance, a first width of the first channel structure is different from a second width of the second channel structure, and a first length of the first channel structure is different from a second length of the second channel structure.
Public/Granted literature
- US20230005954A1 NONVOLATILE MEMORY DEVICE Public/Granted day:2023-01-05
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