Invention Grant
- Patent Title: Fiber sheet, and layered body, circuit board and electronic board using same
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Application No.: US17441492Application Date: 2020-03-26
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Publication No.: US12273996B2Publication Date: 2025-04-08
- Inventor: Tomohiro Fukao , Tomoaki Sawada , Takatoshi Abe , Kyosuke Michigami
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP2019-061650 20190327
- International Application: PCT/JP2020/013827 WO 20200326
- International Announcement: WO2020/196790 WO 20201001
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B5/02 ; B32B15/08 ; B32B27/12
Abstract:
A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
Public/Granted literature
- US20220183154A1 FIBER SHEET, AND LAYERED BODY, CIRCUIT BOARD AND ELECTRONIC BOARD USING SAME Public/Granted day:2022-06-09
Information query
