An induction curing system comprises a slip sheet and a power supply. The slip sheet comprises a layup surface configured to receive a composite material, a tool interface surface configured to interface with an upper surface of a tool, a rigid body extending between the layup surface and the tool interface surface, and an induction coil circuit within the rigid body of the slip sheet. The induction coil circuit is configured to heat the layup surface to a temperature sufficient to cure the composite material. The induction coil circuit has a diameter selected to generate heat using a power supply having a frequency below 150 kHz. The rigid body is configured to support the composite material during transport of the composite material. The power supply is coupled with the induction coil circuit, the power supply is selected based on the diameter of the induction coil circuit.