Invention Grant
- Patent Title: Adhesive bonding of beam and node assemblies
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Application No.: US18312140Application Date: 2023-05-04
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Publication No.: US12292077B2Publication Date: 2025-05-06
- Inventor: Todd H Smith , Joshua Solomon , Ethan Edward Peel Hodge , Joel S Hooton
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Agency: Lorenz & Kopf LLP
- Main IPC: F16B11/00
- IPC: F16B11/00 ; B29C65/54 ; F16B39/02 ; B29C65/00 ; B29C65/48 ; C09J5/02 ; C09J5/04

Abstract:
An assembly and a method are provided for manufacturing a joined assembly. A method for manufacturing includes fitting together and datuming a beam and a node, wherein at least one of the beam and the node is formed with an aperture, and wherein a cylindrical interface is formed between the beam and node. Further, the method includes advancing a mechanical fastener through the aperture to temporarily hold the beam and the node in an engagement. Also, the method includes injecting a structural adhesive into the cylindrical interface between the beam and the node. The method includes final joining the beam and the node by curing the structural adhesive.
Public/Granted literature
- US20240368430A1 ADHESIVE BONDING OF BEAM AND NODE ASSEMBLIES Public/Granted day:2024-11-07
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