Invention Grant
- Patent Title: Connection module
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Application No.: US17691270Application Date: 2022-03-10
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Publication No.: US12296641B2Publication Date: 2025-05-13
- Inventor: Masakazu Morimoto , Yasuhiro Mizuno , Masaki Uchiyama , Yuki Sugiyama
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Priority: JP2019-166783 20190913,JP2020-146775 20200901
- Main IPC: B60H1/00
- IPC: B60H1/00 ; F25B41/40 ; F25B41/42

Abstract:
A plurality of components of a refrigeration cycle are connected to a connection module. The connection module includes a body having a refrigerant flow path that constitutes a part of a refrigerant flow path in the refrigeration cycle. The refrigerant flow path includes a high-temperature-side flow path and a low-temperature-side flow path. The high-temperature-side flow path has a connection port to which a high-temperature-side component of the plurality of components, through which a high-pressure refrigerant of the refrigeration cycle flows, is connectable. The low-temperature-side flow path has a connection port to which a low-temperature-side component of the plurality of components, through which a refrigerant having a lower temperature than the high-pressure refrigerant flows, is connectable.
Public/Granted literature
- US20220194167A1 CONNECTION MODULE Public/Granted day:2022-06-23
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