Invention Grant
- Patent Title: Bonding device and method of manufacturing display device using the same
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Application No.: US18436887Application Date: 2024-02-08
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Publication No.: US12302738B2Publication Date: 2025-05-13
- Inventor: Kisang Yoo , Kyungrok Ko , Youngsu Kim , Jaesuk Yoo , Jeong-Seop Choi
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: CANTOR COLBURN LLP
- Priority: KR10-2020-0114287 20200908
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/18 ; H10K50/84 ; H10K71/00 ; H10K59/12 ; H10K102/00

Abstract:
A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.
Public/Granted literature
- US20240188405A1 BONDING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME Public/Granted day:2024-06-06
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