Invention Grant
- Patent Title: Soldering apparatus
- Patent Title (中): 焊接设备
-
Application No.: US2657725Application Date: 1925-04-29
-
Publication No.: US1750312APublication Date: 1930-03-11
- Inventor: EMMERT RODGER J
- Applicant: DELCO REMY CORP
- Assignee: Delco Remy Corp
- Current Assignee: Delco Remy Corp
- Priority: US2657725 1925-04-29
- Main IPC: B23K31/02
- IPC: B23K31/02
Information query
IPC分类:
