A conductive paste is provided which can ensure plating adhesion and joint strength between an external electrode and a ceramic body, and which can prevent sticking between electronic devices. The conductive paste, which contains substantially no alkaline earth metal and no lead, comprises powdered silver; a powdered glass containing an alkali metal oxide, boron oxide, silicon oxide, zinc oxide, and aluminum oxide; and an organic vehicle; wherein the powdered glass is composed of about 5 to 12 percent by weight of alkali metal oxide as M2O, M being at least one element selected from the group consisting of Li, Na, K, Rb, Cs and Fr, about 35 to 45 percent by weight of boron oxide as B2O3, about 10 to 20 percent by weight of silicon oxide as SiO2, about 35 to 45 percent by weight of zinc oxide as ZnO, and about 1 to 5 percent by weight of aluminum oxide as Al2O3.