公开(公告)号：US20020012608A1

公开(公告)日：2002-01-31

申请号：US09878818

申请日：2001-06-11

申请人： Murata Manufacturing Co., Ltd.

发明人： Hidekiyo Takaoka ,  Kunihiko Hamada

IPC分类号： B23K001/19 ,  B23K020/16 ,  C22C007/00 ,  C22C025/00 ,  C22C020/00

CPC分类号： C22C12/00 ,  B23K35/264 ,  Y10T428/12681 ,  Y10T428/24917

摘要： Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

摘要翻译： 提供一种具有优异的耐热性的无铅焊料组合物，当对基板上形成的电极图案进行焊接时，不会损坏玻璃基板和基板上的部件。 无铅焊料组合物包含例如不小于约90重量％的Bi，约0.1重量％至9.9重量％的Ag和约0.1重量％至3.0重量％的Sb，基于整体 焊料组成。

公开(公告)号：US20040214418A1

公开(公告)日：2004-10-28

申请号：US10849129

申请日：2004-05-20

申请人： Murata Manufacturing Co., Ltd.

发明人： Satoru Noda ,  Takeshi Miki ,  Kunihiko Hamada

IPC分类号： H01L021/44

CPC分类号： H01G4/2325 ,  C03C8/14 ,  C03C8/18 ,  H01C1/1406 ,  H01C1/148 ,  H05K1/092

摘要： A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

摘要翻译： 提供了一种用于形成具有镍内部电极的单片陶瓷电子部件的端子电极的导电膏。 导电糊包括银粉和银合金粉，硼粉，无机粘合剂和有机载体中的至少一种。 硼粉的量为导电糊的总重量的至少约0.5重量％且小于约7.0重量％。

公开(公告)号：US20020006023A1

公开(公告)日：2002-01-17

申请号：US09870552

申请日：2001-05-30

申请人： Murata Manufacturing co., Ltd.

发明人： Kiyotaka Maegawa ,  Kunihiko Hamada

IPC分类号： H01G004/008

CPC分类号： H01G4/232

摘要： A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called nulladhesion defectnull is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.

摘要翻译： 一种能够形成端子电极的导电膏，其中在导电部件烧结期间保持玻璃的粘度的同时进行烧结，从而防止软化玻璃流入陶瓷元件组件和端子电极之间的界面 或者在端子电极的表面上流动，此外，在端子电极膜的空腔中残留有足够的玻璃，从而对电镀液的渗透提供优异的密封，所谓的“粘附缺陷” 被防止发生。 另外，提供陶瓷电子部件。 导电性糊料由含有Cu和Ni中的至少一种的玻璃料和有机载体的导电性成分构成，其中玻璃料含有可结晶玻璃，导电性成分的烧结开始温度高于结晶起始 可结晶玻璃的温度低于可结晶玻璃的再熔化温度。

公开(公告)号：US20040096632A1

公开(公告)日：2004-05-20

申请号：US10704814

申请日：2003-11-12

申请人： Murata Manufacturing Co., Ltd.

发明人： Hidekiyo Takaoka ,  Kunihiko Hamada

IPC分类号： B32B015/04 ,  C22C012/00

CPC分类号： C22C12/00 ,  B23K35/264 ,  Y10T428/12681 ,  Y10T428/24917

摘要： Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

摘要翻译： 提供一种具有优异的耐热性的无铅焊料组合物，当对基板上形成的电极图案进行焊接时，不会损坏玻璃基板和基板上的部件。 无铅焊料组合物包含例如不小于约90重量％的Bi，约0.1重量％至9.9重量％的Ag和约0.1重量％至3.0重量％的Sb，基于整体 焊料组成。

公开(公告)号：US20010016252A1

公开(公告)日：2001-08-23

申请号：US09777464

申请日：2001-02-06

申请人： Murata Manufacturing Co., Ltd.

发明人： Toshiki Nagamoto ,  Kunihiko Hamada

IPC分类号： H01B001/22 ,  H01G004/12

CPC分类号： H01G4/232 ,  H01B1/16 ,  Y10T428/24917

摘要： A conductive paste is provided which can ensure plating adhesion and joint strength between an external electrode and a ceramic body, and which can prevent sticking between electronic devices. The conductive paste, which contains substantially no alkaline earth metal and no lead, comprises powdered silver; a powdered glass containing an alkali metal oxide, boron oxide, silicon oxide, zinc oxide, and aluminum oxide; and an organic vehicle; wherein the powdered glass is composed of about 5 to 12 percent by weight of alkali metal oxide as M2O, M being at least one element selected from the group consisting of Li, Na, K, Rb, Cs and Fr, about 35 to 45 percent by weight of boron oxide as B2O3, about 10 to 20 percent by weight of silicon oxide as SiO2, about 35 to 45 percent by weight of zinc oxide as ZnO, and about 1 to 5 percent by weight of aluminum oxide as Al2O3.

摘要翻译： 提供了可以确保外部电极和陶瓷体之间的电镀附着力和接合强度，并且可以防止电子器件之间粘附的导电膏。 基本上不含碱土金属而不含铅的导电糊包含粉状银; 含有碱金属氧化物，氧化硼，氧化硅，氧化锌，氧化铝的玻璃粉末; 和有机车辆; 其中，所述粉末状玻璃由约5〜12重量％的碱金属氧化物作为M 2 O组成，M为选自Li，Na，K，Rb，Cs和Fr中的至少一种元素，约35〜45重量％ 的氧化硼作为B 2 O 3，约10〜20重量％的作为SiO 2的氧化硅，约35〜45重量％的氧化锌作为ZnO，约1〜5重量％的氧化铝作为Al 2 O 3。

公开(公告)号：US20010001481A1

公开(公告)日：2001-05-24

申请号：US09757861

申请日：2001-01-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Yukio Sanada ,  Hiromasa Takahashi ,  Shinichiro Kuroiwa ,  Masaki Fujiyama ,  Kunihiko Hamada ,  Aira Otani

IPC分类号： H01B001/00 ,  H01F001/00 ,  C04B002/00 ,  C10F005/00

CPC分类号： H01G4/0085 ,  H01B1/16

摘要： An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90null or less as measured in a nitrogen atmosphere.

摘要翻译： 描述了即使在低氧浓度的气氛中即使在严格控制气氛的情况下也能形成致密电极膜的导电性糊料。 包含Cu粉末，玻璃料和有机粘合剂树脂的导电糊料，其中玻璃料包含含Zn和Cu的硼硅酸盐玻璃，并且在熔融状态下，相对于Cu的接触角为90°或更小，如 氮气氛围。

公开(公告)号：US20010030493A1

公开(公告)日：2001-10-18

申请号：US09800991

申请日：2001-03-07

申请人： Murata Manufacturing Co., Ltd.

发明人： Satoru Noda ,  Kunihiko Hamada

IPC分类号： H01J001/02

CPC分类号： H01G4/232

摘要： A laminated ceramic capacitor is provided having superior elastic and bending characteristics and having a high mechanical strength withstanding the thermal shock generated when mounting is performed on a circuit substrate by soldering. The laminated ceramic capacitor is composed of a laminate and external electrodes, wherein the laminate is formed of a plurality of ceramic layers and a plurality of internal electrodes provided therebetween so that an end of each internal electrode is exposed at one of edge surfaces of the laminate, and the external electrodes are connected to the internal electrodes and contains a conductive component and a glass having a Young's modulus of about 9null109 Pa or less.

摘要翻译： 提供了具有优异的弹性和弯曲特性并且具有高的机械强度的层压陶瓷电容器，其耐受通过焊接在电路基板上进行安装时产生的热冲击。 层压陶瓷电容器由层压体和外部电极构成，其中层叠体由多个陶瓷层和设置在其间的多个内部电极形成，使得每个内部电极的端部暴露在层压体的一个边缘表面处 并且外部电极连接到内部电极并且包含导电成分和杨氏模量为约9×10 9 Pa以下的玻璃。