- Patent Title: Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
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Application No.: US09746960Application Date: 2000-12-21
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Publication No.: US20010020546A1Publication Date: 2001-09-13
- Inventor: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
- Applicant: FormFactor, Inc.
- Applicant Address: null
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: null
- Main IPC: H01B007/00
- IPC: H01B007/00 ; H01B011/00
Abstract:
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
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