Invention Application
US20020003238A1 Structure including cubic boron nitride films and method of forming the same 审中-公开
包括立方氮化硼薄膜的结构及其形成方法

  • Patent Title: Structure including cubic boron nitride films and method of forming the same
  • Patent Title (中): 包括立方氮化硼薄膜的结构及其形成方法
  • Application No.: US09824376
    Application Date: 2001-04-02
  • Publication No.: US20020003238A1
    Publication Date: 2002-01-10
  • Inventor: Jamal RamdaniLyndee L. Hilt
  • Applicant: Motorola, Inc.
  • Applicant Address: null
  • Assignee: Motorola, Inc.
  • Current Assignee: Motorola, Inc.
  • Current Assignee Address: null
  • Main IPC: H01L031/0328
  • IPC: H01L031/0328
Structure including cubic boron nitride films and method of forming the same
Abstract:
High quality cubic boron nitride layers can be grown overlying monocrystalline substrates (102) such as large silicon wafers by forming a compliant substrate for growing the nitride layer. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer (104) on a silicon wafer (102). The accommodating buffer layer (104) is a layer of monocrystalline oxide spaced apart from the silicon wafer (102) by an amorphous interface layer of silicon oxide (108). The amorphous interface layer (108) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer (104).
Information query
Patent Agency Ranking
0/0