Invention Application
- Patent Title: Semiconductor manufactring apparatus, and positioning jig used for same
- Patent Title (中): 半导体制造设备和用于其的定位夹具
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Application No.: US09899192Application Date: 2001-07-06
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Publication No.: US20020005166A1Publication Date: 2002-01-17
- Inventor: Takashi Kisaichi
- Priority: JP209929/2000 20000711
- Main IPC: C23F001/02
- IPC: C23F001/02 ; B05C013/00

Abstract:
The placement of a wafer can be performed with good positional precision, and the positioning of wafer clamps during maintenance is facilitated. A tapered recess is formed in that portion of the wafer support on which a wafer is placed. When a wafer is placed in the recess, the sloped surface inside this recess comes into contact with the edge of the wafer from beneath the wafer. The wafer is supported in a specific attitude by the sloped surface inside this recess.
Public/Granted literature
- US06921457B2 Semiconductor manufacturing apparatus, and positioning jig used for same Public/Granted day:2005-07-26
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