Invention Application
US20020005166A1 Semiconductor manufactring apparatus, and positioning jig used for same 失效
半导体制造设备和用于其的定位夹具

  • Patent Title: Semiconductor manufactring apparatus, and positioning jig used for same
  • Patent Title (中): 半导体制造设备和用于其的定位夹具
  • Application No.: US09899192
    Application Date: 2001-07-06
  • Publication No.: US20020005166A1
    Publication Date: 2002-01-17
  • Inventor: Takashi Kisaichi
  • Priority: JP209929/2000 20000711
  • Main IPC: C23F001/02
  • IPC: C23F001/02 B05C013/00
Semiconductor manufactring apparatus, and positioning jig used for same
Abstract:
The placement of a wafer can be performed with good positional precision, and the positioning of wafer clamps during maintenance is facilitated. A tapered recess is formed in that portion of the wafer support on which a wafer is placed. When a wafer is placed in the recess, the sloped surface inside this recess comes into contact with the edge of the wafer from beneath the wafer. The wafer is supported in a specific attitude by the sloped surface inside this recess.
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