Abstract:
A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.
Abstract:
The subject of the invention is a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a liquid seal (14). A natural flow of the liquid metal from the surface of the liquid seal (14) is set up in two overflow compartments (25, 29) made in the said duct (13) and each having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartments is maintained at a level below the surface of the liquid seal (14). Another subject of the invention is a plant for implementing the process.
Abstract:
A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board. In the method, at least one printed circuit board is mounted to a clamping fixture support whereby a clamping fixture overlay is placed on top of the first printed circuit board.
Abstract:
The present invention is a substrate inverting apparatus mounted to a substrate-coating machine. The apparatus is used for inverting a substrate within a vacuum chamber. The apparatus includes a substrate holding means for holding the substrate substantially rigidly relative to the substrate holding means. The apparatus further includes an actuating means mounted to the substrate-coating machine for inverting the substrate holding means.
Abstract:
A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.
Abstract:
A coating booth for film having a table on which a film to be coated is mounted, an air intake which is provided in the ceiling of the booth and through which open air is cleaned and introduced into the inside of the booth, and an exhaust system which sucks up the introduced air from the side walls of the table to make a substantially horizontal air flow inside the table and discharges the air outside, wherein the table has a substantially horizontal tabletop with a plurality of suction holes so that a film mounted thereon are held by suction by the action of the air flow inside the table.
Abstract:
A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.
Abstract:
A semiconductor wafer processing substrate support assembly, comprises a substrate support platform having a centrally disposed recess, coupled to a base disposed above the centrally disposed recess, a plate disposed above the base, and a substrate support disposed above the plate. The substrate support assembly further comprises a plurality of o-rings having a plurality of lobes, wherein a first lobed o-ring of the plurality of lobed o-rings is disposed between the support platform and the base, a second lobed o-ring is disposed between the base and the plate, and a third lobed o-ring is disposed between the plate and the substrate support. Moreover, the plurality of lobed o-rings are utilized in the support assembly for reducing the number of o-rings required in the support assembly.
Abstract:
This invention presents an ESC mechanism for chucking an object electro-statically on a chucking surface, comprising a stage having a dielectric block of which surface is the chucking surface, and a chucking electrode provided in the dielectric block. A temperature controller is provided with the stage for controlling temperature of the object. A chucking power source to apply voltage to the chucking electrode is provided so that the object is chucked. The chucking surface has concaves of which openings are shut by the chucked object. A heat-exchange gas introduction system that introduces heat-exchange gas into the concaves is provided. The concaves include a heat-exchange concave for promoting heat-exchange between the stage and the object under increased pressure, and a gas-diffusion concave for making the introduced gas diffuse to the heat-exchange concave. The gas-diffusion concave is deeper than the heat-exchange concave. This invention also presents a surface processing apparatus, comprising a process chamber in which a surface of an object is processed, and the electro-static chucking mechanism of the same composition.
Abstract:
Methods and devices for protecting and/or coating medical devices are disclosed. In one embodiment, a method is disclosed that includes surrounding a medical device with a cage, the medical device having a surface. The method further includes attaching the medical device to the cage with at least one securement, suspending the medical device in an air stream, the air stream substantially devoid of suspending particles, and coating at least a portion of said surface of said suspended medical device with a first coating material.