Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument

Invention Application

US20020030266A1 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument 有权

Title translation: 半导体装置，半导体装置用基板，其制造方法以及电子仪器

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Patent Title: Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
Patent Title (中): 半导体装置，半导体装置用基板，其制造方法以及电子仪器
Application No.: US09944218

Application Date: 2001-09-04
Publication No.: US20020030266A1

Publication Date: 2002-03-14
Inventor: Akihiro Murata
Applicant: Seiko Epson Corporation
Applicant Address: JP Tokyo
Assignee: Seiko Epson Corporation
Current Assignee: Seiko Epson Corporation
Current Assignee Address: JP Tokyo
Priority: JP10-051357 19980217; JP10-342368 19981116
Main IPC: H01L021/44
IPC: H01L021/44 ; H01L023/48

Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument

Abstract:

A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.

Abstract(Chinese):

一种半导体器件，包括：包括金属部分和树脂部分的基板，并且具有形成在所述树脂部分中的多个通孔，形成在所述通孔内的导电部件，附接到所述基板的一个表面的半导体芯片;以及多个焊球附着在衬底的另一个表面上。半导体芯片和焊球通过导电构件电连接。

Public/Granted literature

US06586274B2 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument Public/Granted day:2003-07-01

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