Invention Application
- Patent Title: Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
- Patent Title (中): 半导体装置,半导体装置用基板,其制造方法以及电子仪器
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Application No.: US09944218Application Date: 2001-09-04
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Publication No.: US20020030266A1Publication Date: 2002-03-14
- Inventor: Akihiro Murata
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP10-051357 19980217; JP10-342368 19981116
- Main IPC: H01L021/44
- IPC: H01L021/44 ; H01L023/48

Abstract:
A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.
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