发明申请
- 专利标题： Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
- 专利标题（中）： 半导体装置，半导体装置用基板，其制造方法以及电子仪器
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申请号： US09944218申请日： 2001-09-04
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公开(公告)号： US20020030266A1公开(公告)日： 2002-03-14
- 发明人: Akihiro Murata
- 申请人： Seiko Epson Corporation
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP10-051357 19980217; JP10-342368 19981116
- 主分类号： H01L021/44
- IPC分类号： H01L021/44 ; H01L023/48
摘要：
A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.
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