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Invention Application
US20020035963A1 Method and apparatus for applying hot-melt pressure sensitive adhesives to a backing material 失效
将热熔压敏粘合剂施加到背衬材料上的方法和设备

  • Patent Title: Method and apparatus for applying hot-melt pressure sensitive adhesives to a backing material
  • Patent Title (中): 将热熔压敏粘合剂施加到背衬材料上的方法和设备
  • Application No.: US09915715
    Application Date: 2001-07-26
  • Publication No.: US20020035963A1
    Publication Date: 2002-03-28
  • Inventor: Axel von Wolff , Stefan Godersky , Robert Mayan , Andreas B. Kummer
  • Priority: DE10037549.9 20000802
  • Main IPC: B05C011/02
  • IPC: B05C011/02
Method and apparatus for applying hot-melt pressure sensitive adhesives to a backing material
Abstract:
A method of partially applying a hot-melt pressure sensitive adhesive composition to a backing material, in which the hot-melt pressure sensitive adhesive composition is applied by an applicator to a moving transfer means in such a way that a film formed from the hot-melt adhesive composition comprises voids; the film applied to the transfer means is subsequently applied to a backing material, which is likewise moving.
Abstract(Chinese):

将热熔压敏粘合剂组合物部分地施加到背衬材料上的方法，其中通过涂布器将热熔压敏粘合剂组合物施加到移动的转移装置，使得由热熔粘合剂组合物形成的膜， 熔融粘合剂组合物包含空隙; 施加到转印装置上的膜随后被施加到同样移动的背衬材料上。

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