Abstract:
A processing solution is supplied from processing-solution suppliers onto the surfaces of targets to be processed while a flow rate of the processing solution is being adjusted. The processing solution is fed from a processing-solution supply source at a specific pressure via a processing-solution pressure-up feeder. The pressure of the processing solution fed via the processing-solution pressure-up feeder is adjust to another specific pressure or more at least when the processing-solution suppliers are operating simultaneously. A flow-rate detector detects the flow rate of the processing solution supplied from each processing-solution supplier. A pressure detector detects the pressure of the processing solution fed via the processing-solution pressure-up feeder. The flow-rate adjuster and the pressure adjuster are controlled based on prestored control data and detection signals from the flow-rate detector and the pressure detector so that the same amount of processing solution is supplied to the targets from the processing-solution suppliers.
Abstract:
A machine for applying sealant material to non-circular closures using a rotating chuck connected to a rotational motor and a fixedly mounted dispensing apparatus. The chuck is also moved in at least one linear direction in a plane normal to the rotational axis of the chuck. The rotational motor may be connected to the chuck using various mechanisms while minimizing the moving mass of the machine. Sealant applicators are also disclosed that are mounted on a turret and use independently controlled motors, or fully integrated servomotors to rotate the chuck.
Abstract:
A cleaning brush and method for removing a coating solution from the inner end of a flexible, tubular substrate to be fitted over a mandrel or drum. After a tubular substrate is dipped endwise in a coating solution, some solution coats the inner face of the substrate at one end. By using moderate deformation of the substrate, changes to the profile of the cleaning brush, or both, the cleaning brush is fitted inside the end of the tubular substrate without damaging the substrate. The cleaning brush engages and cleans the substrate's inner surface. The substrate is then free from any coating so as to readily fit on the mandrel or drum.
Abstract:
A jet type coater with a nozzle orifice is provided with an adjustable, internal filter or screen in the head of the coater. The filter has orifices or slots which are formed by relatively movable members and is adjustable to a size smaller than that of the nozzle orifice, to keep the nozzle orifice unclogged and functioning. The internal filter is also easily clearable on the run without shutdown and cleanable with coating liquid and/or water.
Abstract:
A method of wetting a web of material is described, which in general provides for applying a wetting solution to the web, and passing the web of material between a set of press rolls. The wetting solution may be applied at an add-on greater than 25%, and the web may travel at a speed of at least 60 meters per minute.
Abstract:
A coating apparatus has a spin chuck for attracting and holding a semiconductor wafer in a horizontal state by means of vacuum. A movable beam is arranged above the spin chuck. The movable beam includes first and second nozzles integrally formed. The first nozzle is used for supplying a photo-resist liquid while the second nozzle is used for supplying a solvent for the photo-resist liquid. When a coating process is performed, the movable beam above the wafer is horizontally moved in one direction. The solvent is first supplied onto the wafer from the second nozzle, and the coating or photo-resist liquid is then supplied from the first nozzle, following the solvent. Wettability of the wafer relative to the photo-resist is increased by the solvent, prior to supply of the photo-resist liquid.
Abstract:
The invention generally provides a method of coating a material, the method including the following steps: (a) forming a generally elongate coating structure (15), the coating structure having an internal cavity (17) extending at least substantially along its length, and wherein the internal cavity of the coating structure is capable of receiving a core material (21); (b) inserting a core material (21) into the internal cavity (17) of the coating structure (15); (c) compressing the coating structure at a first location (44) along its length so as generally to form a seal at that location; and (d) compressing the coating structure at a second location along its length (45).
Abstract:
There are provided a spin coating method and an apparatus for forming a thin film having a uniform thickness on a substrate at a low cost in a process for manufacturing semiconductors, optical disks and the like. A coating solution is dropped onto the surface of a substrate (2) to be coated, mounted on a horizontal turn table (3) through a discharge nozzle (4) and the substrate is turned to form a thin film. After the coating solution is dropped through the nozzle, a stand-by nozzle tip (4a) is soaked and held in a nozzle soaking solution (10) having a composition near or equivalent to that of the coating solution. The crystal deposition of the solute is suppressed. Inter alia, the present invention is useful when a solution containing a solute having high crystallizability is coated.
Abstract:
A method for applying drywall mud to drywall tape allowing for lengthy stoppages in a drywall application process comprises threading the drywall tape through mud in a container. When the drywall process is interrupted, a strip of material is attached to at least one surface of the drywall tape between the roll and the container. The strip of material is substantially longer than the distance across the container and has a tensile strength substantially unaffected by prolonged exposure to drywall mud. The drywall tape with attached material is drawn through the container until both ends of the strip of material extend outside the container on opposite sides thereof. The container is sealed and the apparatus, with tape still threaded through the container may now be left for a prolonged period of time. When it is desired to re-commence the drywall process, the drywall tape and applied material is drawn through the slots until the material exits the container and is torn off and discarded, leaving a free end of drywall tape outside the container available for grasping and pulling more drywall tape. The material is conveniently adhesive tape. An apparatus for conveniently applying mud to drywall tape is also provided.
Abstract:
A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.