发明申请
US20020068792A1 Low-temperature, heat-activated adhesives with high heat resistance properties 有权
低温,热活化粘合剂具有高耐热性能

  • 专利标题: Low-temperature, heat-activated adhesives with high heat resistance properties
  • 专利标题(中): 低温,热活化粘合剂具有高耐热性能
  • 申请号: US09954943
    申请日: 2001-09-18
  • 公开(公告)号: US20020068792A1
    公开(公告)日: 2002-06-06
  • 发明人: Irina KobylanskaDavid M. KonkusDavid A. Ley
  • 主分类号: C08K003/00
  • IPC分类号: C08K003/00
Low-temperature, heat-activated adhesives with high heat resistance properties
摘要:
The present invention is directed to a polymer component having controlled branching, formed from the reaction product of a prepolymer and a chain extender, which prepolymer is itself formed from the reaction product of a mixture of a non-self-associating isocyanate component, a diol component having a molecular weight from about 1500 to 6000 grams/mole and present in an amount greater than about 50% by weight based on the total weight of the prepolymer, and an ion-forming compound, where the chain extender includes an amine-containing compound and is present in an amount sufficient to react with at least about 99% of the isocyanate groups present after the prepolymer has been formed, wherein the controlled branching of the polymer includes at least one of: a hydroxy-functional component having hydroxyl functionality greater than 2.0 and a molecular weight from about 700 to 2000; or a low molecular weight component having more than two hydroxyl groups. Methods of making and using such dispersion compositions are also included.
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