Invention Application
- Patent Title: Method for electrostatic force bonding and a system thereof
- Patent Title (中): 静电力接合方法及其系统
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Application No.: US10016782Application Date: 2001-12-10
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Publication No.: US20020072201A1Publication Date: 2002-06-13
- Inventor: Michael D. Potter
- Applicant: Rochester Institute of Technology
- Applicant Address: null
- Assignee: Rochester Institute of Technology
- Current Assignee: Rochester Institute of Technology
- Current Assignee Address: null
- Main IPC: H01L021/30
- IPC: H01L021/30 ; H01L021/46

Abstract:
A method for electrostatic bonding includes placing a first region of a first unit at least adjacent to a first region of a second unit. The first region of the first unit has trapped charge. A bond between the first region of the first unit and the first region of the second unit is formed by the electrostatic forces between the trapped charge and induced charge in the first region of the second unit. A system for electrostatic bonding includes a first unit having a first region with trapped charge and a second unit with a first region with induced charge. Electrostatic forces between the trapped charge in the first region of the first unit and the induced charge in the first region of the second unit bond the first and second units together.
Public/Granted literature
- US06638627B2 Method for electrostatic force bonding and a system thereof Public/Granted day:2003-10-28
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